RACM150-12S/F - RECOM Power

RACM150-12S/F Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use this module in a high-vibration environment?
  Yes, the RACM150-12S/F is designed to withstand high vibrations. It has been tested to meet the IEC 60068-2-6 standard for vibration resistance, which includes sinusoidal vibration at 10-2000 Hz, 2g amplitude, and random vibration at 10-2000 Hz, 4g RMS.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and using a heat sink can help to reduce the module's operating temperature.
• What is the recommended input fuse rating for this module?
  RECOM recommends using a fuse with a rating of 2-3 times the maximum input current of the module, which is 12.5A for the RACM150-12S/F. This will help to protect the module from input overcurrent conditions.
• Can I use this module in a redundant configuration?
  Yes, the RACM150-12S/F can be used in a redundant configuration to achieve higher reliability and availability. However, RECOM recommends consulting with their application engineers to ensure that the redundant configuration is properly designed and implemented.