RACM150-24S/F - RECOM Power

RACM150-24S/F Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use this module in a high-vibration environment?
  Yes, the RACM150-24S/F is designed to withstand high-vibration environments. However, it's recommended to follow the recommended PCB layout and mounting guidelines to ensure the module is securely attached to the PCB and can withstand vibrations up to 10G.
• What is the maximum capacitance load that can be connected to the output?
  The maximum capacitance load that can be connected to the output of the RACM150-24S/F is 2200uF. Exceeding this value may cause instability or oscillation in the output voltage.
• Can I use this module in a redundant configuration?
  Yes, the RACM150-24S/F can be used in a redundant configuration to achieve higher reliability and availability. However, it's recommended to consult with RECOM's application engineers to ensure the correct implementation of the redundant configuration.
• What is the typical efficiency of the module at 50% load?
  The typical efficiency of the RACM150-24S/F at 50% load is around 92%. However, the actual efficiency may vary depending on the input voltage, output load, and operating temperature.