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RB080L-30TE25 - ROHM Semiconductor

Description: Schottky Barrier Diode: ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for PC,mobile phone and various portable electronics.

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PCB Footprints
RB080L-30TE25 - ROHM Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - PMDS
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3D Models
RB080L-30TE25 - ROHM Semiconductor  - 3D model - Diodes Moulded - PMDS
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RB080L-30TE25 Details

  • Manufacturer Part Number:

    RB080L-30TE25

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    PMDS, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.51 V

  • JESD-30 Code:

    R-PDSO-C2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    70 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB080L-30TE25 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer. Additionally, keeping the thermal pad away from other components and ensuring good airflow around the device can help.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Avoid applying excessive force or pressure, which can damage the device.
  • Handle the device by the body, avoiding touching the pins or electrical connections. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and do not stack devices on top of each other.
  • The input capacitor value depends on the input voltage, output voltage, and switching frequency. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF, with a voltage rating higher than the input voltage. Consult the datasheet and application notes for specific guidance.
  • To reduce EMI and noise, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, use a low-ESR output capacitor and ensure good PCB layout practices, such as separating analog and digital grounds.

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RB080L-30TE25 Overview

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