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RB085B-30TL - ROHM Semiconductor

Description: Schottky Barrier Diode: ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for PC,mobile phone and various portable electronics.

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RB085B-30TL - ROHM Semiconductor PCB footprint - Other - Other - CPD
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RB085B-30TL - ROHM Semiconductor  - 3D model - Other - CPD
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RB085B-30TL Details

  • Manufacturer Part Number:

    RB085B-30TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-63, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.48 V

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    35 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB085B-30TL Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power dissipation. Additionally, using a heat sink or a thermal interface material can help to reduce the junction temperature.
  • To prevent damage, it's essential to handle the device by the body and not the leads, avoid bending or twisting the leads, and store the device in a dry, cool place away from direct sunlight. Additionally, using an anti-static wrist strap or mat can help to prevent electrostatic discharge damage.
  • To troubleshoot issues with the device, start by checking the PCB layout and thermal design, ensuring that the device is properly soldered and that there are no signs of physical damage. Next, verify that the device is operated within the recommended conditions, and check for any signs of electrical overstress or electrostatic discharge damage.
  • When using the RB085B-30TL in a high-reliability application, consider the device's operating conditions, derating, and thermal design. Additionally, ensure that the device is properly qualified and screened for the specific application, and consider using redundant or fault-tolerant designs to ensure system reliability.

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RB085B-30TL Overview

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