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RB085BGE-40TL - ROHM Semiconductor

Description: 40V, 10A, TO-252 (DPAK), Schottky Barrier Diode

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RB085BGE-40TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB085BGE-40TL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RB085BGE-40TL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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RB085BGE-40TL Details

  • Manufacturer Part Number:

    RB085BGE-40TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-06-13

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.12

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    200 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RB085BGE-40TL Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note (AN191) for thermal optimization. It suggests using a thermal pad, vias, and a heat sink to improve heat dissipation.
  • To ensure reliability, follow the recommended operating temperature range (Ta = -40°C to 150°C) and consider derating the device's power dissipation according to the ambient temperature. Also, ensure proper thermal design and heat sinking.
  • ROHM recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device.
  • The RB085BGE-40TL is not specifically designed for high-humidity environments. However, if you must use it in such conditions, ensure proper sealing and conformal coating to prevent moisture ingress.
  • The lead time may vary depending on the region and supplier. Check with authorized distributors like Digi-Key, Mouser, or ROHM's website for the latest lead times. Alternative sources may include other manufacturers offering similar devices, such as Diodes Incorporated or ON Semiconductor.

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RB085BGE-40TL Overview

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