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RB085BGE-90TL - ROHM Semiconductor

Description: 90V, 10A, TO-252, Cathode Common, Low V<sub>F</sub> Schottky Barrier Diode

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PCB Footprints
RB085BGE-90TL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RB085BGE-90TL - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RB085BGE-90TL Details

  • Manufacturer Part Number:

    RB085BGE-90TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2020-06-22

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.83 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    90 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RB085BGE-90TL Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note (AN191) for thermal optimization. It suggests using a thermal pad, vias, and a heat sink to improve heat dissipation.
  • To ensure reliability, follow the recommended operating conditions, use a suitable heat sink, and implement thermal monitoring and protection mechanisms. ROHM also provides reliability data in their datasheet and application notes.
  • The maximum allowable power dissipation (PD) is dependent on the ambient temperature (Ta) and the thermal resistance (Rth). According to the datasheet, the maximum PD is 90W at Ta=25°C and Rth=2.5°C/W.
  • Yes, the RB085BGE-90TL is suitable for switching regulator applications due to its low RDS(on) and high-speed switching capabilities. However, ensure that the device is operated within its recommended specifications and follow proper design guidelines.
  • The gate resistor value depends on the specific application, switching frequency, and gate drive voltage. ROHM provides guidelines for gate resistor selection in their application notes (AN191 and AN192). Typically, a value between 10Ω to 100Ω is recommended.

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