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RB088BM100FHTL - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 10A, TO-252 (DPAK), Schottky Barrier Diode for Automotive

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RB088BM100FHTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB088BM100FHTL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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RB088BM100FHTL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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RB088BM100FHTL Details

  • Manufacturer Part Number:

    RB088BM100FHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RB088BM100FHTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RB088BM100FHTL can be found in the ROHM Semiconductor's packaging specification document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using thermal vias and a thermal pad. Also, consider using a heat sink or a thermal interface material to reduce the thermal resistance. Follow the thermal design guidelines in the datasheet and application notes.
  • The maximum allowed voltage for the RB088BM100FHTL is 100V, as specified in the datasheet. Exceeding this voltage may damage the device. Ensure that the voltage rating is not exceeded during operation, including during power-up and power-down sequences.
  • To ensure reliability in high-temperature environments, follow the recommended operating temperature range specified in the datasheet. Implement proper thermal management, and consider using a heat sink or thermal interface material. Also, ensure that the device is operated within the specified power dissipation limits.
  • The RB088BM100FHTL has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and storage. Use ESD-safe materials, and ensure that the device is handled in an ESD-controlled environment to prevent damage.

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RB088BM100FHTL Overview

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