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RB168MM150TR - ROHM Semiconductor

Description: DIODE SCHOTTKY 150V 1A PMDU

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Symbol
RB168MM150TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB168MM150TR - ROHM Semiconductor PCB footprint - Other - Other - RB168MM150TR-1
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3D Models
RB168MM150TR - ROHM Semiconductor - 3D model - Other - RB168MM150TR-1
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RB168MM150TR Details

  • Manufacturer Part Number:

    RB168MM150TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PMDU, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2016-06-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.07

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB168MM150TR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Yes, but ensure that the device is properly sealed and protected from moisture. Apply a conformal coating or potting compound to prevent moisture ingress.
  • Use an ESD wrist strap or mat when handling the device. Ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to prevent damage from electrostatic discharge.

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RB168MM150TR Overview

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