ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.5mm, and a minimum of 5 thermal vias. Additionally, a solid copper fill on the top and bottom layers can help improve thermal dissipation.
To ensure reliability, ROHM recommends following the derating curve for the device, using a heat sink if necessary, and ensuring that the maximum junction temperature (Tj) is not exceeded. Additionally, using a thermally conductive material for the PCB and ensuring good thermal contact between the device and the heat sink can help.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s. It's also important to follow the soldering guidelines for the specific package type (TO-263).
While the RB168MM200TR is a high-speed device, it's not specifically designed for high-frequency switching applications. ROHM recommends using a device specifically designed for high-frequency switching, such as the RB160M series, for such applications.
ROHM recommends following standard ESD precautions, such as using an ESD wrist strap or mat, storing the devices in anti-static packaging, and using ESD-protected equipment during handling and assembly.
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RB168MM200TR Overview
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