ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation to keep the junction temperature below 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
Yes, the RB168VAM-60TR is qualified to AEC-Q101 standards, making it suitable for automotive and high-reliability applications. However, it is recommended to consult with ROHM's quality and reliability team for specific requirements and testing.
ROHM recommends storing the RB168VAM-60TR in a dry, cool place, away from direct sunlight and moisture. Handling should be done with anti-static precautions, and the component should be kept in its original packaging until ready for use.
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RB168VAM-60TR Overview
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