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RB218NS-30FHTL - ROHM Semiconductor

Description: Schottky Barrier Diode,VR 30V,Io 20A,IFSM 100A,TO-263S (D2PAK).

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RB218NS-30FHTL - ROHM Semiconductor PCB footprint - Other - Other - LPTS_Master
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RB218NS-30FHTL - ROHM Semiconductor  - 3D model - Other - LPTS_Master
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RB218NS-30FHTL Details

  • Manufacturer Part Number:

    RB218NS-30FHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-06-25

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.32

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.72 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    35 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB218NS-30FHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 1oz copper thickness and a thermal via diameter of 0.3mm to ensure optimal thermal performance.
  • ROHM recommends using a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. Ensure the device is properly aligned and the solder paste is evenly distributed.
  • The maximum allowed voltage for the RB218NS-30FHTL is 30V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • ROHM recommends using ESD protection devices, such as TVS diodes or ESD arrays, to protect the RB218NS-30FHTL from electrostatic discharge. Ensure proper handling and storage procedures are followed to prevent ESD damage.
  • The recommended operating temperature range for the RB218NS-30FHTL is -40°C to 150°C. Operating the device outside this range may affect its performance and reliability.

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RB218NS-30FHTL Overview

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