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RB218NS-60FHTL - ROHM Semiconductor

Description: Schottky Barrier Diode,VR 60V,Io 20A,IFSM 100A.

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RB218NS-60FHTL - ROHM Semiconductor - PCB symbol
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RB218NS-60FHTL - ROHM Semiconductor PCB footprint - Other - Other - LPTS_Master
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RB218NS-60FHTL - ROHM Semiconductor - 3D model - Other - LPTS_Master
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RB218NS-60FHTL Details

  • Manufacturer Part Number:

    RB218NS-60FHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-06-25

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.38

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.83 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB218NS-60FHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is recommended.
  • To ensure reliable operation, ROHM recommends derating the power dissipation according to the ambient temperature. For example, at 125°C, the power dissipation should be derated to 60% of the maximum rating.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
  • Yes, the RB218NS-60FHTL is designed to operate in humid environments. However, ROHM recommends following the recommended storage and handling procedures to prevent moisture absorption and ensuring that the component is properly sealed or coated to prevent moisture ingress.
  • ROHM estimates the lifespan of the RB218NS-60FHTL to be around 10-15 years under normal operating conditions, with a failure rate of less than 1% per 1,000 hours.

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RB218NS-60FHTL Overview

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Part Image RB218NS-60FH ROHM Semiconductor

Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 60V V(RRM), Silicon, TO-263AB