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RB225NS-40FHTL - ROHM Semiconductor

Description: Schottky Diodes & Rectifiers 40V Vr 30A Io SBD TO-263S(D2PAK) 15A

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PCB Footprints
RB225NS-40FHTL - ROHM Semiconductor PCB footprint - Other - Other - RB225NS-40FHTL-1
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3D Models
RB225NS-40FHTL - ROHM Semiconductor  - 3D model - Other - RB225NS-40FHTL-1
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RB225NS-40FHTL Details

  • Manufacturer Part Number:

    RB225NS-40FHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.32

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    500 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB225NS-40FHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power rating at high temperatures.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less. Consult the ROHM soldering guide for more details.
  • The RB225NS-40FHTL is not designed for use in high-humidity environments. If operation in humid environments is required, consider using a moisture-resistant coating or conformal coating to protect the device.
  • Store the device in a dry, cool place (less than 30°C and 60% RH) away from direct sunlight. Avoid storing the device in environments with high humidity, corrosive gases, or strong electromagnetic fields.

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