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RB228NS100TL - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 30A, TO-263S (D2PAK), Schottky Barrier Diode

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RB228NS100TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB228NS100TL - ROHM Semiconductor PCB footprint - Other - Other - LPTS_Master
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3D Models
RB228NS100TL - ROHM Semiconductor - 3D model - Other - LPTS_Master
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RB228NS100TL Details

  • Manufacturer Part Number:

    RB228NS100TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.38

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    110 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB228NS100TL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The device requires a stable input voltage (Vin) between 2.5V to 5.5V, and a bypass capacitor (e.g., 1uF) should be placed close to the Vin pin to reduce noise.
  • The maximum power dissipation is 1.5W, and the device should be operated within the recommended operating conditions to prevent overheating.
  • The device is rated for operation up to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • Handle the device by the body or use an ESD wrist strap to prevent static electricity damage. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays.

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RB228NS100TL Overview

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