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RB238NS100FHTL - ROHM Semiconductor

Description: Schottky Diodes & Rectifiers 100V Vr 40A Io SBD TO-263S(D2PAK) 20A

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RB238NS100FHTL - ROHM Semiconductor PCB footprint - Other - Other - LPDS_Master
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RB238NS100FHTL - ROHM Semiconductor  - 3D model - Other - LPDS_Master
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RB238NS100FHTL Details

  • Manufacturer Part Number:

    RB238NS100FHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2018-06-25

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.38

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.86 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    110 V

  • Reverse Current-Max:

    20 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RB238NS100FHTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RB238NS100FHTL can be found in the ROHM Semiconductor's package drawing document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal soldering and assembly.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using thermal vias, thermal pads, or a heat sink. Also, follow the recommended operating temperature range and power dissipation guidelines provided in the datasheet. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB.
  • The moisture sensitivity level of RB238NS100FHTL is typically MSL 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60% RH environment before soldering. However, it's recommended to check the specific MSL rating provided by ROHM Semiconductor or on the packaging label to ensure proper handling and storage.
  • While RB238NS100FHTL is a general-purpose resistor, it may not meet the specific requirements for automotive applications, such as AEC-Q200 qualification. If you plan to use this component in an automotive application, it's recommended to consult with ROHM Semiconductor or a qualified distributor to determine its suitability and potential alternatives that meet the necessary automotive standards.
  • To ensure the reliability of RB238NS100FHTL in high-reliability applications, follow proper storage and handling procedures, use a qualified manufacturer-approved distributor, and implement a robust PCB design and assembly process. Additionally, consider performing environmental and reliability testing, such as temperature cycling, humidity testing, and vibration testing, to validate the component's performance in your specific application.

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