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RB520CS3002LYL - Nexperia

Description: Schottky Diodes & Rectifiers RB520CS3002L/SOD882/SOD2

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RB520CS3002LYL - Nexperia - PCB symbol
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RB520CS3002LYL - Nexperia PCB footprint - Other - Other - RB520CS3002LYL-2
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RB520CS3002LYL - Nexperia - 3D model - Other - RB520CS3002LYL-2
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RB520CS3002LYL Details

  • Manufacturer Part Number:

    RB520CS3002LYL

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.64 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.315 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

RB520CS3002LYL Frequently Asked Questions (FAQs)

  • A good layout should include a solid ground plane, thermal vias under the device, and a heat sink if possible. Nexperia provides a recommended layout in their application notes.
  • Follow Nexperia's guidelines for derating the device's current and voltage ratings at high temperatures. Also, ensure good thermal design and consider using a heat sink or thermal interface material.
  • The RB520CS3002LYL has built-in ESD protection, but additional protection measures such as TVS diodes or ESD arrays may be necessary depending on the application. Latch-up prevention can be achieved through careful PCB design and layout.
  • While the RB520CS3002LYL is suitable for high-frequency applications, careful consideration should be given to the device's parasitic capacitance, inductance, and switching losses. Consult Nexperia's application notes for guidance on high-frequency design.
  • Nexperia provides reliability data and MTBF estimates in their datasheet and reliability reports. However, actual reliability may vary depending on the application, operating conditions, and manufacturing quality.

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RB520CS3002LYL Overview

Use the download button to access the RB520CS3002LYL schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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