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RB521S30T5G - onsemi

Description: Low Forward Voltage Drop ; Low Reverse Current; Flat Lead, Surface Mount Device Under 0.70 mm Height; Extremely Small Outline Plastic Package SOD-523; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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RB521S30T5G - onsemi - PCB symbol
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PCB Footprints
RB521S30T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−523 CASE 502−01 ISSUE E
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3D Models
RB521S30T5G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD−523 CASE 502−01 ISSUE E
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RB521S30T5G Details

  • Manufacturer Part Number:

    RB521S30T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523 2 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 502-01, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB521S30T5G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pour under the device for optimal heat dissipation.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Monitor the device's junction temperature (TJ), drain-source voltage (VDS), drain current (ID), and gate-source voltage (VGS) to detect potential faults and ensure reliable operation.
  • Choose a gate driver with a high current capability (> 1A) and a fast rise/fall time (< 10 ns) to ensure reliable switching. Ensure the gate driver's output voltage is compatible with the RB521S30T5G's gate-source voltage rating (VGS).
  • Implement ESD protection measures such as TVS diodes, ESD diodes, or ESD arrays on the PCB to protect the device from electrostatic discharge. Ensure the protection devices are rated for the device's maximum voltage and current ratings.

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RB521S30T5G Overview

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