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RB751S40-QX - Nexperia

Description: Schottky barrier diode 120mA, 40V, SC-79 1.2mm x 0.8mm x 0.6mm -65~150°C.

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RB751S40-QX - Nexperia - PCB symbol
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RB751S40-QX - Nexperia PCB footprint - Other - Other - RB751S40-QX-6
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RB751S40-QX - Nexperia - 3D model - Other - RB751S40-QX-6
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RB751S40-QX Details

  • Manufacturer Part Number:

    RB751S40-QX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-79, SOD-523, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.28 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

RB751S40-QX Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable operation at high temperatures, Nexperia recommends following the recommended operating conditions, using a suitable heat sink, and ensuring good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material (TIM) to reduce thermal resistance.
  • The maximum allowed voltage on the input pins is 5.5V, as specified in the datasheet. Exceeding this voltage may cause damage to the device or affect its reliability.
  • Yes, the RB751S40-QX is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • Nexperia recommends following proper electrostatic discharge (ESD) handling procedures when handling the RB751S40-QX. Use ESD-protective packaging, wrist straps, and mats to prevent damage from static electricity.

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RB751S40-QX Overview

Use the download button to access the RB751S40-QX schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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