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RB751V40T1G - onsemi

Description: Extremely Fast Switching Speed; Extremely Low Forward Voltage -0.28 Volts (Typ) @ IF = 1 mAdc; Low Reverse Current

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PCB Footprints
RB751V40T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323
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3D Models
RB751V40T1G - onsemi  - 3D model - Small Outline Diode - SOD-323
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RB751V40T1G Details

  • Manufacturer Part Number:

    RB751V40T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.03 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB751V40T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the RB751V40T1G, the SOA is limited by the maximum voltage rating of 40V and the maximum current rating of 1A.
  • Use proper ESD handling procedures, such as grounding straps and ESD-safe workstations. Also, consider adding ESD protection devices, such as TVS diodes, to the PCB design.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, not the leads, and avoid bending or flexing the leads.

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RB751V40T1G Overview

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Part Image RB751V40T1 onsemi

Rectifier Diode, Schottky, 1 Phase, 1 Element, 0.03A, 40V V(RRM), Silicon