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RBQ10BM100AFHTL - ROHM Semiconductor

Description: Low IR, 100V, 10A, TO-252 (DPAK), Schottky Barrier Diode for Automotive

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RBQ10BM100AFHTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RBQ10BM100AFHTL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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RBQ10BM100AFHTL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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RBQ10BM100AFHTL Details

  • Manufacturer Part Number:

    RBQ10BM100AFHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2018-07-13

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.77 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    80 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RBQ10BM100AFHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a land pattern with a minimum pad size of 1.3mm x 0.8mm and a solder mask opening of 0.8mm x 0.5mm to ensure reliable soldering and minimize thermal resistance.
  • To ensure proper thermal management, ROHM recommends attaching a heat sink to the top of the device, using a thermal interface material with a thermal conductivity of at least 1 W/mK, and designing the PCB with thermal vias and a sufficient copper area to dissipate heat.
  • ROHM recommends derating the voltage by 10% to 20% to ensure reliable operation and prevent overheating, especially in high-temperature applications.
  • While RBQ10BM100AFHTL is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB design and layout considerations, such as minimizing parasitic inductance and capacitance.
  • To ensure reliability in humid environments, ROHM recommends conformal coating the device, using a moisture-resistant PCB material, and following proper storage and handling procedures to prevent moisture absorption.

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RBQ10BM100AFHTL Overview

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