ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.5mm, and a minimum of 5 thermal vias. Additionally, a solid copper fill on the top and bottom layers can help improve thermal dissipation.
To ensure reliable operation, ROHM recommends derating the power dissipation according to the ambient temperature. For example, at 125°C, the maximum power dissipation should be derated to 60% of the maximum rating. Additionally, ensure proper thermal design and heat sinking to maintain a safe junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component.
Yes, the RBQ10BM45AFHTL is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow ROHM's guidelines for design, manufacturing, and testing to ensure the component meets the required reliability standards.
The RBQ10BM45AFHTL is a moisture-sensitive device (MSD) with a MSL rating of 3. To prevent damage, store the components in a dry environment (less than 20% RH) and follow ROHM's recommended handling and storage procedures. Baking the components before use is also recommended to remove any absorbed moisture.
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RBQ10BM45AFHTL Overview
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