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RBQ10RSM65BTL1 - ROHM Semiconductor

Description: Schottky Diodes & Rectifiers Schottky Barrier Diode 65V, 10A, TO-277GE, Low VF SBD

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RBQ10RSM65BTL1 - ROHM Semiconductor - PCB symbol
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RBQ10RSM65BTL1 - ROHM Semiconductor PCB footprint - Other - Other - RBQ10RSM65BTL1-1
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RBQ10RSM65BTL1 Details

  • Manufacturer Part Number:

    RBQ10RSM65BTL1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-277GE, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.67 V

  • JEDEC-95 Code:

    TO-277A

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    65 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    65 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RBQ10RSM65BTL1 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 1oz copper thickness and a thermal via array underneath the package to ensure optimal heat dissipation.
  • To ensure reliable operation, follow the recommended derating curves for junction temperature (Tj) and ambient temperature (Ta) in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
  • Yes, the RBQ10RSM65BTL1 is designed to withstand vibrations up to 10G (rms) in the frequency range of 10-2000Hz. However, it's essential to follow proper PCB design and assembly guidelines to ensure reliable operation.
  • Store the RBQ10RSM65BTL1 in a dry, cool place with a temperature range of 5-30°C and humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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RBQ10RSM65BTL1 Overview

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