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RBQ15BGE45ATL - ROHM Semiconductor

Description: 45V, 15A, TO-252, Cathode Common, Low IR Schottky Barrier Diode

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PCB Footprints
RBQ15BGE45ATL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RBQ15BGE45ATL - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RBQ15BGE45ATL Details

  • Manufacturer Part Number:

    RBQ15BGE45ATL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-06-18

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.12

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.59 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    140 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RBQ15BGE45ATL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 1oz copper thickness and a thermal via diameter of 0.3mm to ensure optimal thermal performance.
  • To ensure SOA, monitor the device's voltage, current, and temperature. Use the datasheet's SOA graph to determine the maximum allowable voltage and current based on the operating temperature.
  • ROHM recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device.
  • The RBQ15BGE45ATL is not suitable for high-humidity environments. If your application requires operation in humid conditions, consider using a device with a higher moisture sensitivity level or implementing humidity protection measures.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. If you're unsure, consult ROHM's ESD handling guidelines.

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RBQ15BGE45ATL Overview

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