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RBR15BM60AFHTL - ROHM Semiconductor

Description: Schottky Diodes & Rectifiers 60V Vr 15A Io SBD TO-252(DPAK) 5A IF

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RBR15BM60AFHTL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RBR15BM60AFHTL - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RBR15BM60AFHTL Details

  • Manufacturer Part Number:

    RBR15BM60AFHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2018-06-25

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.58 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    400 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RBR15BM60AFHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or thermal interface material to reduce thermal resistance.
  • ROHM recommends limiting voltage transients to ±10% of the rated voltage to prevent damage to the device.
  • Yes, but ensure that the switching frequency is within the recommended range (typically up to 100 kHz) and that the device is properly snubbed to prevent ringing and voltage spikes.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and ensure that the PCB layout and handling procedures follow ESD-safe practices.

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RBR15BM60AFHTL Overview

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