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RBR20BM40AFHTL - ROHM Semiconductor

Description: Low V<sub>F</sub>, 40V, 20A, TO-252 (DPAK), Schottky Barrier Diode for Automotive

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RBR20BM40AFHTL - ROHM Semiconductor - PCB symbol
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RBR20BM40AFHTL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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RBR20BM40AFHTL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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RBR20BM40AFHTL Details

  • Manufacturer Part Number:

    RBR20BM40AFHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.32

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    360 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RBR20BM40AFHTL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A minimum of 1oz copper thickness is also recommended.
  • To ensure reliability, operate the device within the recommended temperature range (TJ = -40°C to 150°C). Implement proper thermal management, and consider derating the device's power dissipation at higher temperatures.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more information.
  • While the RBR20BM40AFHTL is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure the device is properly sealed, and consider applying a moisture-resistant coating to prevent corrosion.
  • Handle the device with care, using anti-static wrist straps, mats, and packaging. Avoid touching the device's pins, and use EOS/ESD protection devices in the circuit design.

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RBR20BM40AFHTL Overview

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