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RBR2VWM30ATFTR - ROHM Semiconductor

Description: Low V<sub>F</sub>, 30V, 2A, Schottky Barrier Diode for Automoive

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RBR2VWM30ATFTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RBR2VWM30ATFTR - ROHM Semiconductor PCB footprint - Other - Other - RBR2VWM30ATFTR-2
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RBR2VWM30ATFTR - ROHM Semiconductor - 3D model - Other - RBR2VWM30ATFTR-2
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RBR2VWM30ATFTR Details

  • Manufacturer Part Number:

    RBR2VWM30ATFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-06-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.1

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.53 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RBR2VWM30ATFTR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is recommended.
  • ROHM recommends derating the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure proper heat sinking and thermal management to prevent overheating.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more information.
  • Yes, the RBR2VWM30ATFTR is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • ROHM recommends storing the component in a dry environment with a relative humidity of 50% or less. If the component is exposed to moisture, follow the recommended baking procedure before soldering to prevent damage.

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RBR2VWM30ATFTR Overview

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