ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper derating guidelines, provide adequate heat sinking, and consider using a thermal interface material (TIM) between the device and heat sink. Additionally, ensure that the device is operated within the recommended junction temperature (Tj) range.
ROHM recommends soldering the RBR2VWM60ATR using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. The device should be soldered using a Pb-free solder alloy, and the soldering process should be performed in a nitrogen atmosphere to minimize oxidation.
To prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, avoid touching the pins, and use an ESD wrist strap or mat during assembly. Ensure that the assembly process and equipment are ESD-compliant, and consider using ESD-protective packaging and materials.
Store the RBR2VWM60ATR in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C (-40°F to 257°F), and the device should be stored in its original packaging or an ESD-protective bag to prevent damage.
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RBR2VWM60ATR Overview
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