Description:The RC19020 is a 20-output PCIe Gen6 buffer that is backward compatible to earlier PCIe generations. The RC19020 provides ultra-low additive jitter and reduced in-to-out delay performance for better design-margin and incorporates several features for easier and more robust design.RC19020 is also pin-compatible to DB2000Q/DB2000QL plus adding LOS indication and SBI_OUT pin for multiple clock chip daisy-chain.
GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power Supply Current-Max (ICC):
439 mA
Prop. Delay@Nom-Sup:
1.8 ns
Propagation Delay (tpd):
1.8 ns
Same Edge Skew-Max (tskwd):
0.06 ns
Seated Height-Max:
0.9 mm
Supply Voltage-Max (Vsup):
3.63 V
Supply Voltage-Min (Vsup):
2.97 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
BOTTOM
Width:
6 mm
fmax-Min:
400 MHz
RC19020AGN6#KD0 Frequently Asked Questions (FAQs)
Renesas provides a reference design guide for the RC19020AGN6, which includes recommendations for PCB layout, thermal management, and power supply design. It's essential to follow these guidelines to ensure optimal performance, thermal stability, and reliability.
Renesas recommends using a power management IC (PMIC) specifically designed for the RC19020AGN6, such as the RAA210851. This PMIC provides the necessary power sequencing, voltage regulation, and monitoring functions to ensure reliable operation.
The RC19020AGN6 requires a 32.768 kHz crystal oscillator with a specific load capacitance and ESR. Renesas provides guidelines for selecting the correct crystal and capacitors in the datasheet and application notes.
To optimize power consumption, use the RC19020AGN6's power-saving modes, such as the Low Power Mode (LPM) and the Deep Sleep Mode (DSM). Additionally, optimize the clock frequency, use dynamic voltage and frequency scaling, and minimize peripheral usage to reduce power consumption.
Renesas provides guidelines for EMC and EMI considerations in the datasheet and application notes. Key considerations include using a shielded enclosure, minimizing trace lengths, and using EMI filters and shielding components to reduce radiation and susceptibility.
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RC19020AGN6#KD0 Overview
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