RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the RCD-24-0.30/PL/B is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's recommended to follow proper mounting and screw torque guidelines to ensure reliable operation.
The maximum allowed input capacitance for the RCD-24-0.30/PL/B is 47uF. Exceeding this value may cause instability or oscillation in the module. It's recommended to use a capacitor with a low ESR (Equivalent Series Resistance) to minimize the risk of oscillation.
Yes, the RCD-24-0.30/PL/B can be used in redundant or parallel configurations to achieve higher power ratings or improve system reliability. However, it's essential to follow proper design guidelines and ensure that the modules are properly synchronized and isolated to prevent damage or instability.
The typical MTBF for the RCD-24-0.30/PL/B is >1 million hours at 40°C ambient temperature, calculated according to MIL-HDBK-217F. This makes it suitable for use in high-reliability applications.
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RCD-24-0.30/PL/B Overview
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