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RCX080N25 - ROHM Semiconductor

Description: 10V Drive Nch MOSFET

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PCB Footprints
RCX080N25 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM_2022
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3D Models
RCX080N25 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM_2022
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RCX080N25 Details

  • Manufacturer Part Number:

    RCX080N25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FM, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    4.66 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    32 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RCX080N25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RCX080N25 is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate within the -40°C to 125°C range for optimal performance and reliability.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Typically, a voltage supply of 12V to 15V is recommended, with a current limit of 25mA. Additionally, ensure the device is properly decoupled with capacitors to minimize noise and voltage fluctuations.
  • For optimal thermal management, it's recommended to use a thermal pad or heat sink on the bottom of the package. Ensure the PCB layout provides adequate clearance around the device for heat dissipation. A 2-layer or 4-layer PCB with a solid ground plane is recommended to minimize thermal resistance and electromagnetic interference (EMI).
  • To prevent electrostatic discharge (ESD) damage, handle the device with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. When handling the device, avoid touching the pins or leads, and use an ESD-safe container for storage. Follow proper ESD handling procedures during assembly and testing.
  • For optimal soldering, follow the recommended temperature profile: 240°C to 260°C peak temperature, with a soldering time of 3 to 5 seconds. Ensure the soldering iron is ESD-safe, and use a solder with a melting point above 217°C. Avoid using excessive soldering temperature or time, as this can damage the device.

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RCX080N25 Overview

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