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RCX081N20 - ROHM Semiconductor

Description: 10V Drive Nch Power MOSFET

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PCB Footprints
RCX081N20 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM_2022
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3D Models
RCX081N20 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM_2022
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RCX081N20 Details

  • Manufacturer Part Number:

    RCX081N20

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220FM, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    5.17 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.77 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    32 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RCX081N20 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation, ROHM recommends using a low-ESR capacitor (e.g., ceramic or film capacitor) with a value of 10nF to 100nF between the VIN and GND pins. Additionally, a snubber circuit may be necessary to reduce ringing and overshoot.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed 6V to prevent damage to the device.
  • While the RCX081N20 is rated for operation up to 150°C, ROHM recommends derating the device's power dissipation and voltage ratings at high temperatures. Consult the datasheet and ROHM's application notes for specific guidance on high-temperature operation.
  • Power dissipation can be calculated using the formula: Pd = (VIN x IIN) + (VOUT x IOUT) + (VIN x Iq), where Iq is the quiescent current. ROHM provides a power dissipation calculator and thermal design guidelines in their application notes to help with this calculation.

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RCX081N20 Overview

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