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RCX100N25 - ROHM Semiconductor

Description: 10V Drive Nch MOSFET

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PCB Footprints
RCX100N25 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM_2022
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3D Models
RCX100N25 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM_2022
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RCX100N25 Details

  • Manufacturer Part Number:

    RCX100N25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220FM, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    7.29 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.32 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RCX100N25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RCX100N25 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to provide a stable voltage supply within the recommended range (Vgs = 2.5V to 10V, Vds = 10V to 25V), and maintain a sufficient gate-source voltage (Vgs) to achieve the desired on-state resistance (Rds(on)).
  • For optimal thermal management, use a multi-layer PCB with a thermal via or a heat sink, and ensure a low thermal resistance path from the device to the ambient air. Keep the PCB layout compact, and minimize the distance between the device and the heat sink or thermal via.
  • To protect the RCX100N25 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded. Use ESD-sensitive handling procedures, and consider adding ESD protection devices (e.g., TVS diodes) to the circuit.
  • The maximum allowable power dissipation for the RCX100N25 is 30W, but this value can be derated based on the operating temperature and PCB thermal design. Ensure that the device operates within the recommended power dissipation limits to prevent overheating and ensure reliability.

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RCX100N25 Overview

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