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RCX330N25 - ROHM Semiconductor

Description: 10V Drive Nch MOSFET

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PCB Footprints
RCX330N25 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM
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3D Models
RCX330N25 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM
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RCX330N25 Details

  • Manufacturer Part Number:

    RCX330N25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FM, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    74.8 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    33 A

  • Drain-source On Resistance-Max:

    0.105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    132 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RCX330N25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RCX330N25 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating curves for the device, and consider the thermal resistance and power dissipation of the package.
  • A recommended PCB layout for the RCX330N25 includes a thermal pad connected to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
  • Yes, the RCX330N25 is suitable for high-frequency switching applications up to 1 MHz, but it's essential to consider the device's switching losses and thermal performance.
  • To protect the RCX330N25, use a suitable overvoltage protection circuit, such as a zener diode or a transient voltage suppressor, and consider adding overcurrent protection using a fuse or a current-sensing resistor.

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RCX330N25 Overview

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