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RCX700N20 - ROHM Semiconductor

Description: 10V Drive Nch MOSFET

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PCB Footprints
RCX700N20 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM-22-1
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3D Models
RCX700N20 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM-22-1
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RCX700N20 Details

  • Manufacturer Part Number:

    RCX700N20

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220FM, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    396 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    70 A

  • Drain-source On Resistance-Max:

    0.0427 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    140 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RCX700N20 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RCX700N20 is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate within the -40°C to 125°C range for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended voltage and current conditions outlined in the datasheet. Typically, this involves applying a voltage of 12V to 15V to the drain (D) pin, and a voltage of 0V to 5V to the gate (G) pin, while keeping the source (S) pin at 0V. Additionally, ensure the device is properly heatsinked to prevent thermal issues.
  • For optimal thermal performance, it's recommended to use a multi-layer PCB with a thermal via structure to dissipate heat efficiently. Place the device on a large copper area, and ensure good thermal conductivity between the device and the heat sink. A thermal interface material (TIM) can be used to improve heat transfer. Follow ROHM's recommended PCB layout guidelines and thermal management strategies for the RCX700N20.
  • To protect the RCX700N20 from ESD, follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Ensure that the device is properly grounded during handling and assembly. Additionally, consider implementing ESD protection circuits in your design, such as TVS diodes or ESD protection arrays.
  • The RCX700N20 is designed to meet high reliability standards, with a typical lifespan of 10 to 15 years or more, depending on operating conditions and environmental factors. ROHM provides reliability data and guidelines in the datasheet and application notes. Follow recommended operating conditions, and ensure proper thermal management and ESD protection to maximize the device's lifespan.

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RCX700N20 Overview

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