ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider derating the device's power rating according to the temperature derating curve in the datasheet.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
Yes, but ensure proper moisture protection measures are taken, such as conformal coating or potting, to prevent moisture ingress and corrosion.
Check the input voltage, output load, and feedback resistors for proper configuration and values. Also, verify that the device is properly heat-sinked and that the PCB layout is optimized for thermal performance.
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RD3H080SPTL1 Overview
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