RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the REC10-2415D/H2/M is designed to withstand high vibrations. It is compliant with IEC 60068-2-6, which specifies the vibration test requirements for electrical components. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
To ensure reliability in high-temperature environments, it's essential to follow RECOM's derating guidelines for temperature and power output. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce the thermal resistance between the module and the heat sink.
RECOM recommends using a low-ESR input capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
Yes, the REC10-2415D/H2/M can be used in redundant or parallel configurations. However, it's essential to consult with RECOM's application engineers to ensure the modules are properly synchronized and configured to meet the specific requirements of your application.
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REC10-2415D/H2/M Overview
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