RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness and a thermal via array under the module are also recommended.
Yes, the REC15-125.1S/H2/M is designed to withstand high vibrations and meets the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to consult with RECOM's application engineers to ensure the module is properly secured and mounted.
The REC15-125.1S/H2/M has a built-in input filter that meets the EN 55022 Class A and CISPR 22 Class A standards. However, the system's overall EMC performance may require additional filtering or shielding. Consult with RECOM's application engineers to ensure compliance with your specific EMC requirements.
RECOM recommends using a minimum of 2 x 22 μF, 100 V, X7R or X5R ceramic capacitors in parallel as input capacitors to ensure stable operation and minimize input ripple.
Yes, the REC15-125.1S/H2/M can be used in redundant or parallel configurations to achieve higher power or redundancy. However, it's recommended to consult with RECOM's application engineers to ensure proper design and implementation of the redundant or parallel system.
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REC15-125.1S/H2/M Overview
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