RECOM recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2oz copper thickness. A thermal via array under the module can also improve heat dissipation.
RECOM recommends using a soldering profile with a peak temperature of 240°C for 30-60 seconds. Ensure the module is properly aligned with the PCB pads and use a solder with a melting point above 217°C.
RECOM recommends using a low-ESR capacitor with a value of 10-22uF, X7R or X5R dielectric, and a voltage rating of 50V or higher.
Yes, the REC5-2405SRW/H6/A is designed to withstand vibrations up to 10G. However, it's recommended to secure the module to the PCB using screws or adhesive to prevent movement during operation.
Check the input voltage, output load, and PCB layout for any issues. Verify that the module is properly soldered and that the input capacitor is of sufficient value and type. Consult the datasheet and RECOM's application notes for further guidance.
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REC5-2405SRW/H6/A Overview
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