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REF198ESZ-REEL - Analog Devices

Description: Voltage References PRECISION MICRO POWER VOLTAGE REFERENCE

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REF198ESZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - - [SOIC_N]-1
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REF198ESZ-REEL - Analog Devices  - 3D model - Small Outline Packages - - [SOIC_N]-1
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REF198ESZ-REEL Details

  • Manufacturer Part Number:

    REF198ESZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    4.098 V

  • Output Voltage-Min:

    4.094 V

  • Output Voltage-Nom:

    4.096 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.05%

  • Width:

    3.9 mm

REF198ESZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for REF198ESZ-REEL involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure accurate voltage reference output, ensure that the input voltage is within the recommended range, the device is properly decoupled, and the output is not loaded excessively. Also, use a low-ESR capacitor for decoupling and avoid using long output traces.
  • The thermal derating of REF198ESZ-REEL is 1.67 mW/°C, which means that the device's power dissipation should be reduced by 1.67 mW for every degree Celsius above the maximum operating temperature of 125°C.
  • Yes, REF198ESZ-REEL is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high performance and low defect rates. However, it is essential to follow proper design and manufacturing practices to ensure the device operates within its specifications.
  • To handle the ESD sensitivity of REF198ESZ-REEL, follow proper ESD handling procedures during device handling and assembly. Use ESD-protective packaging, wrist straps, and mats, and ensure that the device is not exposed to static electricity during storage or transportation.

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REF198ESZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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