RECOM recommends a PCB layout with a large copper area for heat dissipation, and a thermal via array under the module to improve heat transfer. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1W/mK should be used between the module and the heat sink.
To ensure reliability and longevity, RECOM recommends operating the module within the specified temperature range (-40°C to +85°C). Additionally, a good thermal design, proper cooling, and minimizing power derating can help reduce the risk of overheating and increase the module's lifespan.
The REM2-3.305S is designed to meet CISPR 22 Class B and EN 55022 Class B EMI standards. To minimize EMI and RFI, RECOM recommends using a shielded enclosure, keeping the module away from sensitive circuits, and using EMI filters or common-mode chokes if necessary.
Yes, the REM2-3.305S can be used in a redundant or parallel configuration to increase power availability and reliability. However, RECOM recommends consulting with their application engineers to ensure proper design and implementation to avoid any potential issues.
The REM2-3.305S is certified to UL 60950-1, EN 60950-1, and IEC 60950-1 safety standards. RECOM recommends following proper safety precautions when handling and installing the module, such as avoiding electrical shock and ensuring proper insulation and grounding.
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REM2-3.305S Overview
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