OUTPUT OVER VOLTAGE; OVER CURRENT; OVER TEMPERATURE; OVER LOAD
Ripple Voltage (Main Out):
0.0265125 Vrms
Seated Height-Max:
10.7 mm
Surface Mount:
NO
Technology:
HYBRID
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
PIN/PEG
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
5
Total Power Output-Max:
30 W
Trim/Adjustable Output:
YES
Warm-up Time:
0.06 s
Width:
25.4 mm
REM30-4812SW Frequently Asked Questions (FAQs)
RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the REM30-4812SW is designed to withstand high vibrations. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is designed to withstand the vibrations. Additionally, the module's thermal interface material should be suitable for high-vibration applications.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
Yes, the REM30-4812SW can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, it's essential to ensure that the modules are properly synchronized and that the system is designed to handle the increased power and heat dissipation.
According to RECOM, the typical MTBF for the REM30-4812SW is >1.5 million hours at 40°C ambient temperature, calculated according to MIL-HDBK-217F.
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REM30-4812SW Overview
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