ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
ROHM recommends derating the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 1W. Additionally, ensure good airflow and thermal management to prevent overheating.
ROHM recommends a 10uF to 22uF X7R or X5R ceramic capacitor with a voltage rating of 10V or higher, placed as close to the VIN pin as possible.
ROHM recommends following standard EOS prevention practices, such as using anti-static wrist straps, mats, and bags, and avoiding direct contact with the device pins.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s or slower.
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RESD1CANYFHT116 Overview
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