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RF05VYM2SFHTR - ROHM Semiconductor

Description: Super Fast Recovery Diode (AEC-Q101 Qualified)

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PCB Footprints
RF05VYM2SFHTR - ROHM Semiconductor PCB footprint - Other - Other - RF05VYM2SFHTR-3
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3D Models
RF05VYM2SFHTR - ROHM Semiconductor  - 3D model - Other - RF05VYM2SFHTR-3
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RF05VYM2SFHTR Details

  • Manufacturer Part Number:

    RF05VYM2SFHTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.98 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    6 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RF05VYM2SFHTR Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, minimize signal loss, and reduce electromagnetic interference.
  • The RF05VYM2SFHTR has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat dissipation through a heat sink, thermal vias, or a thermal interface material. Follow ROHM's thermal design guidelines and consider simulation tools to optimize thermal performance.
  • ROHM provides recommended soldering conditions and reflow profiles in their application notes. Typically, a peak reflow temperature of 260°C with a 3°C/s ramp rate is recommended. Ensure proper soldering techniques and follow industry standards for lead-free soldering.
  • Follow ROHM's EMC guidelines and consider using shielding, filtering, and grounding techniques to minimize EMI. Ensure proper PCB layout, component placement, and cable routing to reduce electromagnetic radiation.
  • ROHM provides reliability data and environmental testing results in their datasheet and application notes. The RF05VYM2SFHTR is designed to operate in harsh environments, but it's essential to consider factors like temperature, humidity, and vibration when designing for reliability and durability.

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RF05VYM2SFHTR Overview

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