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RF1001T2D - ROHM Semiconductor

Description: ROHM RF1001T2D, Dual Diode, Common Cathode, 200V 10A, 30ns, 3-Pin TO-220

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PCB Footprints
RF1001T2D - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - RF1001T2D
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3D Models
RF1001T2D - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - RF1001T2D
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RF1001T2D Details

  • Manufacturer Part Number:

    RF1001T2D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FN, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    VERY FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.93 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RF1001T2D Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces as short as possible and use 50-ohm impedance matching to minimize signal loss.
  • Ensure good thermal conductivity by using a heat sink or thermal pad, and avoid exposing the device to extreme temperatures during storage or operation.
  • The recommended input impedance is 50 ohms, and the output impedance is also 50 ohms. Impedance matching is crucial for optimal performance and to prevent signal reflections.
  • No, the RF1001T2D is not designed for switching power supply applications. It's intended for RF amplification and transmission applications only.
  • Check the PCB layout, impedance matching, and power supply voltage. Verify that the device is operated within the specified temperature range and that the input signal is within the recommended power range.

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RF1001T2D Overview

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