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RF1501TF3SC9 - ROHM Semiconductor

Description: Fast Recovery Diode

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PCB Footprints
RF1501TF3SC9 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220NFM_2022-1
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3D Models
RF1501TF3SC9 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO220NFM_2022-1
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RF1501TF3SC9 Details

  • Manufacturer Part Number:

    RF1501TF3SC9

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220NFM, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-12-20

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    SUPER FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    350 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.03 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RF1501TF3SC9 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and a microstrip line layout for the RF signal path. The datasheet provides a recommended PCB layout, but it's essential to consult with ROHM's application notes and layout guidelines for specific guidance.
  • The RF1501TF3SC9 requires a specific biasing scheme to operate correctly. ROHM recommends using a voltage regulator to provide a stable 3.3V supply, and a bias resistor network to set the desired bias point. Consult the datasheet and application notes for specific biasing recommendations.
  • While the datasheet provides some information on power handling, it's essential to consult ROHM's application notes and reliability reports for specific guidance on maximum power handling. In general, the RF1501TF3SC9 can handle up to 30dBm of input power, but this may vary depending on the specific application and operating conditions.
  • ROHM provides a troubleshooting guide in their application notes, which covers common issues and their solutions. Additionally, engineers can use simulation tools and modeling techniques to identify and resolve issues related to oscillation or instability.
  • Yes, the RF1501TF3SC9 has a maximum junction temperature of 150°C. ROHM recommends using a thermal pad or heat sink to dissipate heat, especially in high-power applications. Engineers should also ensure good airflow and thermal management in their system design.

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RF1501TF3SC9 Overview

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