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RF4E070BNTR1 - ROHM Semiconductor

Description: MOSFET, N-CH, 30V, 7A, DFN2020 ROHS COMPLIANT: YES

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RF4E070BNTR1 - ROHM Semiconductor - PCB symbol
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RF4E070BNTR1 - ROHM Semiconductor PCB footprint - Other - Other - RF4E070BNTR1-1
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RF4E070BNTR1 - ROHM Semiconductor - 3D model - Other - RF4E070BNTR1-1
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RF4E070BNTR1 Details

  • Manufacturer Part Number:

    RF4E070BNTR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN2020-8S, 8 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    3.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    28 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RF4E070BNTR1 Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in the application note AN11984, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The device has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The device is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C to ensure reliability and prevent damage.
  • Yes, the device is rated for operation in humid environments, but it's essential to follow proper handling and storage procedures to prevent moisture-related damage. ROHM recommends following the IPC/JEDEC J-STD-033 standard for moisture-sensitive devices.
  • ROHM recommends following the IPC/JEDEC J-STD-020 standard for soldering, with a peak temperature of 260°C and a dwell time of 30 seconds. Ensure that the soldering process is optimized to prevent thermal damage to the device.

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