RF601T2DNZC9 footprint, schematic symbol and 3D model by ROHM Semiconductor

Symbol

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PCB Footprints

RF601T2DNZC9 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FN(3PIN)

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3D Models

RF601T2DNZC9 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO-220FN(3PIN)

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Datasheet Download Datasheet
Stock & Prices Price & Stock for RF601T2DNZC9
Part Number RF601T2DNZC9
Manufacturer ROHM Semiconductor
Pin Count 3
Part Category Diode
Package Category Transistor Outline, Vertical
Footprint Name Transistor Outline, Vertical - TO-220FN(3PIN)
Released Date Sep 16, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

RF601T2DNZC9 Details

Manufacturer Part Number:
RF601T2DNZC9
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
Package Description:
TO-220FN, 3 PIN
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Date Of Intro:
2017-03-13
Manufacturer:
ROHM Semiconductor
YTEOL:
3
Application:
SUPER FAST RECOVERY
Case Connection:
ISOLATED
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.93 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
60 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Output Current-Max:
3 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
260
Rep Pk Reverse Voltage-Max:
200 V
Reverse Current-Max:
10 µA
Reverse Recovery Time-Max:
0.025 µs
Surface Mount:
NO
Terminal Finish:
Tin (Sn)
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

RF601T2DNZC9 Frequently Asked Questions (FAQs)

ROHM recommends a 4-layer PCB with a solid ground plane, and a microstrip line layout for the RF signal path. A dedicated application note (AN1891) provides detailed guidelines for PCB layout and design considerations.
The RF601T2DNZC9 requires a bias voltage of 2.7V to 5.5V. Ensure the bias voltage is stable and noise-free, and that the device is operated within the recommended operating conditions. A voltage regulator or a low-dropout regulator (LDO) can be used to provide a stable bias voltage.
The RF601T2DNZC9 can handle a maximum input power of +20 dBm. Exceeding this power limit may cause damage to the device or affect its performance. Ensure the input power is within the recommended range to maintain optimal performance and device reliability.
Common issues with the RF601T2DNZC9 can be troubleshooted by checking the PCB layout, ensuring proper biasing, and verifying the input signal quality. Also, check for any signs of damage, such as overheating or physical stress. ROHM provides an application note (AN1892) that provides troubleshooting guidelines and tips.
Yes, the RF601T2DNZC9 is compatible with lead-free soldering processes. ROHM ensures that their devices meet the requirements of the RoHS (Restriction of Hazardous Substances) directive, and the device can be soldered using lead-free soldering techniques.

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RF601T2DNZC9 Overview

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RF601T2DNZC9 - ROHM Semiconductor

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