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RFL30TZ6SGC13 - ROHM Semiconductor

Description: Rectifiers 650V 30A, TO-247-2L, Ultra Soft Recovery Type, Ultra Fast Recovery Diode

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RFL30TZ6SGC13 - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFL30TZ6SGC13 - ROHM Semiconductor PCB footprint - Other - Other - TO-247-2L
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RFL30TZ6SGC13 - ROHM Semiconductor - 3D model - Other - TO-247-2L
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RFL30TZ6SGC13 Details

  • Manufacturer Part Number:

    RFL30TZ6SGC13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-247GE, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFL30TZ6SGC13 Frequently Asked Questions (FAQs)

  • The recommended PCB land pattern can be found in the ROHM Semiconductor's documentation, specifically in the 'Packaging Specifications' section. The recommended land pattern is provided in the form of a diagram or a table with dimensions.
  • To ensure proper soldering, follow the recommended soldering conditions and profiles provided in the datasheet. Additionally, use a soldering technique that minimizes thermal stress on the component, such as using a soldering iron with a controlled temperature and a suitable solder alloy.
  • The maximum allowed voltage for the RFL30TZ6SGC13 is specified in the datasheet as the 'Absolute Maximum Rating' for the voltage parameter. It is essential to operate the component within this specified range to prevent damage or degradation.
  • Handle the RFL30TZ6SGC13 with care during storage and transportation to prevent mechanical stress and damage. Store the components in their original packaging or in a dry, clean environment, and avoid exposing them to extreme temperatures or humidity.
  • Thermal management is crucial for the RFL30TZ6SGC13. Ensure proper heat dissipation by providing a sufficient thermal path from the component to a heat sink or a thermal pad. The datasheet provides guidance on thermal management, including thermal resistance and power dissipation ratings.

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RFL30TZ6SGC13 Overview

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