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RFN10BM3STL - ROHM Semiconductor

Description: Super Fast Recovery Diode

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PCB Footprints
RFN10BM3STL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RFN10BM3STL - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RFN10BM3STL Details

  • Manufacturer Part Number:

    RFN10BM3STL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-63, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    350 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.03 µs

  • Reverse Test Voltage:

    350 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN10BM3STL Frequently Asked Questions (FAQs)

  • A good PCB layout for the RFN10BM3STL involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the use of vias. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the stability of the output voltage, it's essential to use a sufficient output capacitor (at least 10uF) and to place it as close to the output pin as possible. Additionally, the input capacitor should be at least 1uF and placed close to the input pin.
  • The maximum ambient temperature range for the RFN10BM3STL is -40°C to 105°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, the RFN10BM3STL is suitable for high-reliability applications. ROHM Semiconductor has implemented various quality control measures to ensure the device meets the required standards for reliability and durability.
  • To handle thermal management, it's essential to provide adequate heat dissipation. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources. The maximum junction temperature of the RFN10BM3STL is 150°C.

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RFN10BM3STL Overview

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