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RFN10BM6STL - ROHM Semiconductor

Description: ROHM 600V 10A, Diode, 3-Pin DPAK RFN10BM6STL

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RFN10BM6STL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFN10BM6STL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RFN10BM6STL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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RFN10BM6STL Details

  • Manufacturer Part Number:

    RFN10BM6STL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-63, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.55 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN10BM6STL Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and the use of vias to connect the thermal pad to the ground plane. Additionally, keep the PCB traces as short and wide as possible to minimize inductance and resistance.
  • Use a thermal interface material (TIM) between the device and the heat sink, and ensure the heat sink is properly attached to the device. ROHM recommends a thermal resistance of less than 10°C/W. Also, ensure good airflow around the device and heat sink.
  • Although the datasheet doesn't specify a maximum gate voltage, it's generally recommended to keep the gate voltage between -5V and +20V to prevent damage to the device.
  • Yes, the RFN10BM6STL is suitable for high-frequency switching applications up to 1MHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and ringing.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Also, use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins.

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RFN10BM6STL Overview

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